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Electronic Packaging Material
Asia-Pacific Electronic Packaging Material Market
- Report Code: EL 1002
- Publish Date: Upcoming
Asia-Pacific Electronic Packaging Material Market
Semiconductor and IC packaging Material play an important role in the electronic packaging Material industry as these enhance the safety and protection of electronic components. The Asia-Pacific Electronic Packaging Material Market was valued at $14,896.9 million in 2013 and is expected to reach $18,839.5 million in 2019 with a growing CAGR of 5.1% from 2014. The demand for packaging Material is primarily driven by the demand in end-user industries and increased demand for mobile and computing applications.
Electronic packaging Material are used to provide protection against corrosion, external impact and also hold the contact pins or leads used to connect from external circuits to the device of semiconductors and ICs.
Asia-Pacific holds the largest market for semiconductor and IC packaging Material and expected to see further growth with technological innovations and the need for smaller packaging Material, especially for the applications related to consumer Electronic.
Major investment activities for semiconductor packaging Material are being undertaken in China, as it is considered to have the highest potential in the Asia-Pacific region. The next dynamic technology for packaging market is expected to be embedded substrates, and Taiwan is expected to be the major contributor for this market.
The key countries covered in Asia-Pacific Electronic Packaging Material Market are China, Japan, South Korea, Taiwan and others. The various applications studied in Asia-Pacific Electronic Packaging Material Market include semiconductors and ICs. The different types studied in Asia-Pacific Electronic Packaging Material market include organic substrates, ceramic packages, leadframes, die attach Material, encapsulation resins, and others. Different types of packaging technology such as SOP, GA, QFN, DFN QFP, DIP, and others are also studied in the Asia-Pacific Electronic Packaging Material market. Further, as a part of qualitative analysis, the Asia-Pacific Electronic Packaging Material Market research report provides a comprehensive review of the important drivers, restraints, opportunities, and burning issues in the Asia-Pacific Electronic Packaging Material Market.
The Asia-Pacific Electronic Packaging Material Market report also provides an extensive competitive landscape of the companies operating in this market. It also includes the company profiles of and competitive strategies adopted by various market players, including BASF, Hitachi Chemical Co. Ltd. and Alent plc etc.
Customization Options:
With Market data, you can also customize MMM assessments that meet your Company’s specific needs. Customize to get comprehensive industry standards and deep dive analysis of the following parameters:
- Competitive landscape with a detailed comparison of portfolio of each company mapped at the regional and country-level
- Detailed analysis of Competitive Strategies like new product Launch, expansion, Merger & acquisitions etc. adopted by various companies and their impact on Asia-Pacific Electronic Packaging Material Market
- Scale analysis that comprises comparison with Global Electronic Packaging Material Market
- Burning Issues, Opportunities and information on the market under consideration
- SWOT analysis prior to the top companies of Asia-Pacific Electronic Packaging Material Market
- Porter’s five forces analysis to analyze and determine the market situation and long term profitability of the market under consideration
1 Introduction
1.1 Objective of the study
1.2 Market Definitions
1.3 Market Segmentation & Aspects Covered
1.4 Research Methodology
1.4.1 Assumptions (Market Size, Forecast, etc)
2 Executive Summary
3 Market Overview
4 Electronic Packaging Material-Asia-Pacific, By Applications
4.1 Split By Geography
4.1 Electronic Packaging Material-China by Applications
4.1 Electronic Packaging Material-Japan by Applications
4.1 Electronic Packaging Material-South Korea by Applications
4.1 Electronic Packaging Material-Taiwan by Applications
4.2 Electronic Packaging Material-Asia-Pacific-Small Outline Package (SOP)
4.2.1 Electronic Packaging Material-Asia-Pacific-Small Outline Package (SOP), By Geographies
4.2.1.1 Electronic Packaging Material-China-Small Outline Package (SOP)
4.2.1.2 Electronic Packaging Material-Japan-Small Outline Package (SOP)
4.2.1.3 Electronic Packaging Material-South Korea-Small Outline Package (SOP)
4.2.1.4 Electronic Packaging Material-Taiwan-Small Outline Package (SOP)
4.3 Electronic Packaging Material-Asia-Pacific-Grid Array (GA)
4.3.1 Electronic Packaging Material-Asia-Pacific-Grid Array (GA), By Geographies
4.3.1.1 Electronic Packaging Material-China-Grid Array (GA)
4.3.1.2 Electronic Packaging Material-Japan-Grid Array (GA)
4.3.1.3 Electronic Packaging Material-South Korea-Grid Array (GA)
4.3.1.4 Electronic Packaging Material-Taiwan-Grid Array (GA)
4.4 Electronic Packaging Material-Asia-Pacific-Quad Flat No-leads package (QFN)
4.4.1 Electronic Packaging Material-Asia-Pacific-Quad Flat No-leads package (QFN), By Geographies
4.4.1.1 Electronic Packaging Material-China-Quad Flat No-leads package (QFN)
4.4.1.2 Electronic Packaging Material-Japan-Quad Flat No-leads package (QFN)
4.4.1.3 Electronic Packaging Material-South Korea-Quad Flat No-leads package (QFN)
4.4.1.4 Electronic Packaging Material-Taiwan-Quad Flat No-leads package (QFN)
4.5 Electronic Packaging Material-Asia-Pacific-Dual Flat No Lead Package (DFN)
4.5.1 Electronic Packaging Material-Asia-Pacific-Dual Flat No Lead Package (DFN), By Geographies
4.5.1.1 Electronic Packaging Material-China-Dual Flat No Lead Package (DFN)
4.5.1.2 Electronic Packaging Material-Japan-Dual Flat No Lead Package (DFN)
4.5.1.3 Electronic Packaging Material-South Korea-Dual Flat No Lead Package (DFN)
4.5.1.4 Electronic Packaging Material-Taiwan-Dual Flat No Lead Package (DFN)
4.6 Electronic Packaging Material-Asia-Pacific-Quad Flat Package (QFP)
4.6.1 Electronic Packaging Material-Asia-Pacific-Quad Flat Package (QFP), By Geographies
4.6.1.1 Electronic Packaging Material-China-Quad Flat Package (QFP)
4.6.1.2 Electronic Packaging Material-Japan-Quad Flat Package (QFP)
4.6.1.3 Electronic Packaging Material-South Korea-Quad Flat Package (QFP)
4.6.1.4 Electronic Packaging Material-Taiwan-Quad Flat Package (QFP)
4.7 Electronic Packaging Material-Asia-Pacific-Dual in-line package (DIP)
4.7.1 Electronic Packaging Material-Asia-Pacific-Dual in-line package (DIP), By Geographies
4.7.1.1 Electronic Packaging Material-China-Dual in-line package (DIP)
4.7.1.2 Electronic Packaging Material-Japan-Dual in-line package (DIP)
4.7.1.3 Electronic Packaging Material-South Korea-Dual in-line package (DIP)
4.7.1.4 Electronic Packaging Material-Taiwan-Dual in-line package (DIP)
5 Electronic Packaging Material-Asia-Pacific, By Types
5.1 Split By Geography
5.2 Electronic Packaging Material-China by Types
5.1 Electronic Packaging Material-Japan by Types
5.1 Electronic Packaging Material-South Korea by Types
5.1 Electronic Packaging Material-Taiwan by Types
5.2 Electronic Packaging Material-Organic Substrates-Asia-Pacific
5.2.1 Electronic Packaging Material-Organic Substrates-Asia-Pacific, By Geographies
5.2.1.1 Electronic Packaging Material-Organic Substrates-China
5.2.1.2 Electronic Packaging Material-Organic Substrates-Japan
5.2.1.3 Electronic Packaging Material-Organic Substrates-Taiwan
5.2.1.4 Electronic Packaging Material-Organic Substrates-South Korea
5.3 Electronic Packaging Material-Bonding Wires-Asia-Pacific
5.3.1 Electronic Packaging Material-Bonding Wires-Asia-Pacific, By Geographies
5.3.1.1 Electronic Packaging Material-Bonding Wires-China
5.3.1.2 Electronic Packaging Material-Bonding Wires-Japan
5.3.1.3 Electronic Packaging Material-Bonding Wires-Taiwan
5.3.1.4 Electronic Packaging Material-Bonding Wires-South Korea
5.4 Electronic Packaging Material-Lead Frames-Asia-Pacific
5.4.1 Electronic Packaging Material-Lead Frames-Asia-Pacific, By Geographies
5.4.1.1 Electronic Packaging Material-Lead Frames-China
5.4.1.2 Electronic Packaging Material-Lead Frames-Japan
5.4.1.3 Electronic Packaging Material-Lead Frames-Taiwan
5.4.1.4 Electronic Packaging Material-Lead Frames-South Korea
5.5 Electronic Packaging Material-Encapsulation Resins-Asia-Pacific
5.5.1 Electronic Packaging Material-Encapsulation Resins-Asia-Pacific, By Geographies
5.5.1.1 Electronic Packaging Material-Encapsulation Resins-China
5.5.1.2 Electronic Packaging Material-Encapsulation Resins-Japan
5.5.1.3 Electronic Packaging Material-Encapsulation Resins-Taiwan
5.5.1.4 Electronic Packaging Material-Encapsulation Resins-South Korea
5.6 Electronic Packaging Material-Ceramic Packages-Asia-Pacific
5.6.1 Electronic Packaging Material-Ceramic Packages-Asia-Pacific, By Geographies
5.6.1.1 Electronic Packaging Material-Ceramic Packages-China
5.6.1.2 Electronic Packaging Material-Ceramic Packages-Japan
5.6.1.3 Electronic Packaging Material-Ceramic Packages-Taiwan
5.6.1.4 Electronic Packaging Material-Ceramic Packages-South Korea
5.7 Electronic Packaging Material-Die Attach Materials-Asia-Pacific
5.7.1 Electronic Packaging Material-Die Attach Materials-Asia-Pacific, By Geographies
5.7.1.1 Electronic Packaging Material-Die Attach Materials-China
5.7.1.2 Electronic Packaging Material-Die Attach Materials-Japan
5.7.1.3 Electronic Packaging Material-Die Attach Materials-Taiwan
5.7.1.4 Electronic Packaging Material-Die Attach Materials-South Korea
5.8 Electronic Packaging Material-Thermal Interface Materials-Asia-Pacific
5.8.1 Electronic Packaging Material-Thermal Interface Materials-Asia-Pacific, By Geographies
5.8.1.1 Electronic Packaging Material-Thermal Interface Materials-China
5.8.1.2 Electronic Packaging Material-Thermal Interface Materials-Japan
5.8.1.3 Electronic Packaging Material-Thermal Interface Materials-Taiwan
5.8.1.4 Electronic Packaging Material-Thermal Interface Materials-South Korea
5.9 Electronic Packaging Material-Solder Balls-Asia-Pacific
5.9.1 Electronic Packaging Material-Solder Balls-Asia-Pacific, By Geographies
5.9.1.1 Electronic Packaging Material-Solder Balls-China
5.9.1.2 Electronic Packaging Material-Solder Balls-Japan
5.9.1.3 Electronic Packaging Material-Solder Balls-Taiwan
5.9.1.4 Electronic Packaging Material-Solder Balls-South Korea
6 Electronic Packaging Material-Asia-Pacific, By Technologies
6.1 Split By Geography
6.3 Electronic Packaging Material-China by Technologies
6.1 Electronic Packaging Material-Japan by Technologies
6.1 Electronic Packaging Material-South Korea by Technologies
6.1 Electronic Packaging Material-Taiwan by Technologies
6.2 Dual in-line package (DIP)-Asia-Pacific
6.2.1 Dual in-line package (DIP)-Asia-Pacific, By Geographies
6.2.1.1 Dual in-line package (DIP)-China
6.2.1.2 Dual in-line package (DIP)-Japan
6.2.1.3 Dual in-line package (DIP)-Taiwan
6.2.1.4 Dual in-line package (DIP)-South Korea
6.3 Small Outline Package (SOP)-Asia-Pacific
6.3.1 Small Outline Package (SOP)-Asia-Pacific, By Geographies
6.3.1.1 Small Outline Package (SOP)-China
6.3.1.2 Small Outline Package (SOP)-Japan
6.3.1.3 Small Outline Package (SOP)-Taiwan
6.3.1.4 Small Outline Package (SOP)-South Korea
6.4 Grid Array (GA)-Asia-Pacific
6.4.1 Grid Array (GA)-Asia-Pacific, By Geographies
6.4.1.1 Grid Array (GA)-China
6.4.1.2 Grid Array (GA)-Japan
6.4.1.3 Grid Array (GA)-Taiwan
6.4.1.4 Grid Array (GA)-South Korea
6.5 Quad Flat No-leads package (QFN)-Asia-Pacific
6.5.1 Quad Flat No-leads package (QFN)-Asia-Pacific, By Geographies
6.5.1.1 Quad Flat No-leads package (QFN)-China
6.5.1.2 Quad Flat No-leads package (QFN)-Japan
6.5.1.3 Quad Flat No-leads package (QFN)-Taiwan
6.5.1.4 Quad Flat No-leads package (QFN)-South Korea
6.6 Dual Flat No Lead Package (DFN)-Asia-Pacific
6.6.1 Dual Flat No Lead Package (DFN)-Asia-Pacific, By Geographies
6.6.1.1 Dual Flat No Lead Package (DFN)-China
6.6.1.2 Dual Flat No Lead Package (DFN)-Japan
6.6.1.3 Dual Flat No Lead Package (DFN)-Taiwan
6.6.1.4 Dual Flat No Lead Package (DFN)-South Korea
6.7 Quad Flat Package (QFP)-Asia-Pacific
6.7.1 Quad Flat Package (QFP)-Asia-Pacific, By Geographies
6.7.1.1 Quad Flat Package (QFP)-China
6.7.1.2 Quad Flat Package (QFP)-Japan
6.7.1.3 Quad Flat Package (QFP)-Taiwan
6.7.1.4 Quad Flat Package (QFP)-South Korea
7 Electronic Packaging Material-Asia-Pacific, By Geographies
7.1 Electronic Packaging Material-China
7.1.1 Electronic Packaging Material-China, By Types
7.1.1.1 Electronic Packaging Material-Organic Substrates-China
7.1.1.2 Electronic Packaging Material-Bonding Wires-China
7.1.1.3 Electronic Packaging Material-Lead Frames-China
7.1.1.4 Electronic Packaging Material-Encapsulation Resins-China
7.1.1.5 Electronic Packaging Material-Ceramic Packages-China
7.1.1.6 Electronic Packaging Material-Die Attach Materials-China
7.1.1.7 Electronic Packaging Material-Thermal Interface Materials-China
7.1.1.8 Electronic Packaging Material-Solder Balls-China
7.1.2 Electronic Packaging Material-China, By Applications
7.1.2.1 Electronic Packaging Material-China-Small Outline Package (SOP)
7.1.2.2 Electronic Packaging Material-China-Grid Array (GA)
7.1.2.3 Electronic Packaging Material-China-Quad Flat No-leads package (QFN)
7.1.2.4 Electronic Packaging Material-China-Dual Flat No Lead Package (DFN)
7.1.2.5 Electronic Packaging Material-China-Quad Flat Package (QFP)
7.1.2.6 Electronic Packaging Material-China-Dual in-line package (DIP)
7.1.3 Electronic Packaging Material-China, By Technologies
7.1.3.1 Dual in-line package (DIP)-China
7.1.3.2 Small Outline Package (SOP)-China
7.1.3.3 Grid Array (GA)-China
7.1.3.4 Quad Flat No-leads package (QFN)-China
7.1.3.5 Dual Flat No Lead Package (DFN)-China
7.1.3.6 Quad Flat Package (QFP)-China
7.2 Electronic Packaging Material-Japan
7.2.1 Electronic Packaging Material-Japan, By Types
7.2.1.1 Electronic Packaging Material-Organic Substrates-Japan
7.2.1.2 Electronic Packaging Material-Bonding Wires-Japan
7.2.1.3 Electronic Packaging Material-Lead Frames-Japan
7.2.1.4 Electronic Packaging Material-Encapsulation Resins-Japan
7.2.1.5 Electronic Packaging Material-Ceramic Packages-Japan
7.2.1.6 Electronic Packaging Material-Die Attach Materials-Japan
7.2.1.7 Electronic Packaging Material-Thermal Interface Materials-Japan
7.2.1.8 Electronic Packaging Material-Solder Balls-Japan
7.2.2 Electronic Packaging Material-Japan, By Applications
7.2.2.1 Electronic Packaging Material-Japan-Small Outline Package (SOP)
7.2.2.2 Electronic Packaging Material-Japan-Grid Array (GA)
7.2.2.3 Electronic Packaging Material-Japan-Quad Flat No-leads package (QFN)
7.2.2.4 Electronic Packaging Material-Japan-Dual Flat No Lead Package (DFN)
7.2.2.5 Electronic Packaging Material-Japan-Quad Flat Package (QFP)
7.2.2.6 Electronic Packaging Material-Japan-Dual in-line package (DIP)
7.2.3 Electronic Packaging Material-Japan, By Technologies
7.2.3.1 Dual in-line package (DIP)-Japan
7.2.3.2 Small Outline Package (SOP)-Japan
7.2.3.3 Grid Array (GA)-Japan
7.2.3.4 Quad Flat No-leads package (QFN)-Japan
7.2.3.5 Dual Flat No Lead Package (DFN)-Japan
7.2.3.6 Quad Flat Package (QFP)-Japan
7.3 Electronic Packaging Material-South Korea
7.3.1 Electronic Packaging Material-South Korea, By Types
7.3.1.1 Electronic Packaging Material-Organic Substrates-South Korea
7.3.1.2 Electronic Packaging Material-Bonding Wires-South Korea
7.3.1.3 Electronic Packaging Material-Lead Frames-South Korea
7.3.1.4 Electronic Packaging Material-Encapsulation Resins-South Korea
7.3.1.5 Electronic Packaging Material-Ceramic Packages-South Korea
7.3.1.6 Electronic Packaging Material-Die Attach Materials-South Korea
7.3.1.7 Electronic Packaging Material-Thermal Interface Materials-South Korea
7.3.1.8 Electronic Packaging Material-Solder Balls-South Korea
7.3.2 Electronic Packaging Material-South Korea, By Applications
7.3.2.1 Electronic Packaging Material-South Korea-Small Outline Package (SOP)
7.3.2.2 Electronic Packaging Material-South Korea-Grid Array (GA)
7.3.2.3 Electronic Packaging Material-South Korea-Quad Flat No-leads package (QFN)
7.3.2.4 Electronic Packaging Material-South Korea-Dual Flat No Lead Package (DFN)
7.3.2.5 Electronic Packaging Material-South Korea-Quad Flat Package (QFP)
7.3.2.6 Electronic Packaging Material-South Korea-Dual in-line package (DIP)
7.3.3 Electronic Packaging Material-South Korea, By Technologies
7.3.3.1 Dual in-line package (DIP)-South Korea
7.3.3.2 Small Outline Package (SOP)-South Korea
7.3.3.3 Grid Array (GA)-South Korea
7.3.3.4 Quad Flat No-leads package (QFN)-South Korea
7.3.3.5 Dual Flat No Lead Package (DFN)-South Korea
7.3.3.6 Quad Flat Package (QFP)-South Korea
7.4 Electronic Packaging Material-Taiwan
7.4.1 Electronic Packaging Material-Taiwan, By Types
7.4.1.1 Electronic Packaging Material-Organic Substrates-Taiwan
7.4.1.2 Electronic Packaging Material-Bonding Wires-Taiwan
7.4.1.3 Electronic Packaging Material-Lead Frames-Taiwan
7.4.1.4 Electronic Packaging Material-Encapsulation Resins-Taiwan
7.4.1.5 Electronic Packaging Material-Ceramic Packages-Taiwan
7.4.1.6 Electronic Packaging Material-Die Attach Materials-Taiwan
7.4.1.7 Electronic Packaging Material-Thermal Interface Materials-Taiwan
7.4.1.8 Electronic Packaging Material-Solder Balls-Taiwan
7.4.2 Electronic Packaging Material-Taiwan, By Applications
7.4.2.1 Electronic Packaging Material-Taiwan-Small Outline Package (SOP)
7.4.2.2 Electronic Packaging Material-Taiwan-Grid Array (GA)
7.4.2.3 Electronic Packaging Material-Taiwan-Quad Flat No-leads package (QFN)
7.4.2.4 Electronic Packaging Material-Taiwan-Dual Flat No Lead Package (DFN)
7.4.2.5 Electronic Packaging Material-Taiwan-Quad Flat Package (QFP)
7.4.2.6 Electronic Packaging Material-Taiwan-Dual in-line package (DIP)
7.4.3 Electronic Packaging Material-Taiwan, By Technologies
7.4.3.1 Dual in-line package (DIP)-Taiwan
7.4.3.2 Small Outline Package (SOP)-Taiwan
7.4.3.3 Grid Array (GA)-Taiwan
7.4.3.4 Quad Flat No-leads package (QFN)-Taiwan
7.4.3.5 Dual Flat No Lead Package (DFN)-Taiwan
7.4.3.6 Quad Flat Package (QFP)-Taiwan
8 Electronic Packaging Material-Asia-Pacific, By Companies
8.1 Competitive landscape
8.2 Split By Geography
8.4 Electronic Packaging Material-China by Companies
8.1 Electronic Packaging Material-Japan by Companies
8.1 Electronic Packaging Material-South Korea by Companies
8.1 Electronic Packaging Material-Taiwan by Companies
8.3 Electronic Packaging Material-Asia-Pacific-Hitachi Chemical Company
8.4 Electronic Packaging Material-Asia-Pacific-Kyocera Chemical Corporation
8.5 Electronic Packaging Material-Asia-Pacific-LG Chem Ltd.
8.6 Electronic Packaging Material-Asia-Pacific-Dow Corp
8.7 Electronic Packaging Material-Asia-Pacific-Indium Corporation Of America
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