Europe Electronic Packaging Material Market

Europe Electronic Packaging Material Market

Semiconductor and IC packaging Material play an important role in the electronic packaging Material industry as these enhance the safety and protection of electronic components. The Europe Electronic Packaging Material Market was valued at $2,718.41 million in 2013 and is expected to reach $3,099.88 million in 2019 with a growing CAGR of 3.0% from 2014. The demand for packaging Material is primarily driven by the demand in end-user industries and increased demand for mobile and computing applications.

Electronic packaging Material are used to provide protection against corrosion, external impact and also hold the contact pins or leads used to connect from external circuits to the device of semiconductors and ICs.

The semiconductor and IC packaging Material market is moving at a steady pace in Europe. With the shift in the demand of packaging Material for semiconductor and IC from Europe to the Europe region, the European market is growing relatively at a slower pace than the Europe market

Germany is expected to grow at a CAGR of 3.3% from 2014 to 2019 which is the highest growth rate among other countries in Europe

The key countries covered in Europe Electronic Packaging Material Market are China, Japan, South Korea, Taiwan and others. The various applications studied in Europe Electronic Packaging Material Market include semiconductors and ICs. The different types studied in Europe Electronic Packaging Material market include organic substrates, ceramic packages, leadframes, die attach Material, encapsulation resins, and others. Different types of packaging technology such as SOP, GA, QFN, DFN QFP, DIP, and others are also studied in the Europe Electronic Packaging Material market. Further, as a part of qualitative analysis, the Europe Electronic Packaging Material Market research report provides a comprehensive review of the important drivers, restraints, opportunities, and burning issues in the Europe Electronic Packaging Material Market.

The Europe Electronic Packaging Material Market report also provides an extensive competitive landscape of the companies operating in this market. It also includes the company profiles of and competitive strategies adopted by various market players, including BASF, Hitachi Chemical Co. Ltd. and Alent plc etc.

Customization Options:

With Market data, you can also customize MMM assessments that meet your Company’s specific needs. Customize to get comprehensive industry standards and deep dive analysis of the following parameters:

• Competitive landscape with a detailed comparison of portfolio of each company mapped at the regional and country-level
• Detailed analysis of Competitive Strategies like new product Launch, expansion, Merger & acquisitions etc. adopted by various companies and their impact on Europe Electronic Packaging Material Market
• Scale analysis that comprises comparison with Global Electronic Packaging Material Market
• Burning Issues, Opportunities and information on the market under consideration
• SWOT analysis prior to the top companies of Europe Electronic Packaging Material Market
• Porter’s five forces analysis to analyze and determine the market situation and long term profitability of the market under consideration

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